近场太赫兹成像系统(near field THz microprobe)THz太赫兹成像

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系统特点
系统特点
实现微米级空间分辨率(up to 3 μm)
工作频率覆盖0-4THz
可以配合现有THz光源使用( λ < 860 nm, 1-5 mW)
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应用领域
应用领域
Terahertz research: Metamaterials, plasmonics, graphene, waveguides
High-resolution Terahertz near-field imaging
Contact-free sheet resistance imaging of semiconductors
MMIC device characterization
Non-destructive chip inspection
Time-domain reflectometry (TDR)
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系统配置图
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系统技术指标
系统技术指标
Item MKR-HR MKR-HS
Max. spatial resolution 3μm 100μm
Photoconductive gap size at tip 1.5μm 3μm
Dark current @ 1V Bias < 0.5 nA < 0.4 nA
Photocurrent > 1 μA > 0.6 μA
Excitation wavelength 700nm ... 860 nm
Excitation power 1mW ... 4 mW
Connection type SMP
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系统应用实例
采用近场测量在二氧化硅上石墨烯的电导率不均匀性
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采用近场测量得到的脉冲激励太赫兹材料图像
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